VISIONPAD™ VP3100 Barrier CMP 抛光垫

面议

参数

白色圆片产品特性
是加工定制
化合物半导体种类

发货地上海闵行区 10天内发货供货总量3000片

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产品详情

VISIONPAD™ Copper barrier chemical mechanical polishing (CMP) pads offer significant performance advantages in chemical mechanical planarization during volume production of copper wafers. This new pad combines the benefits of hard and soft polishing pads, with good planarization and low defectivity performance results.

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