Application:
?? Server
Features:
?? SolderBall, SMT Soldering
?? Approved byIntel
Specification:
Mechanical:
?? Pitch:0.508 (X)×0.8814mm (Y)
?? Contact Count:2011Pin
?? Durability:30 Cycles
Electrical:
?? CurrentRating: Min.0.5A / Pin
?? Contact Resistance: Max. 22mΩ(Initial & Final)
Physical:
?? Housing:Thermoplastic, black,
?? Cover Cap: Thermoplastic, black
?? Contact:High-strength copper alloy
Plating: Min. 30u” nickel under plated over all;
selective gold plated on contact area;
Matte-tin on solder tail
??Lever: Stainless steel
??Force Frame and Stiffener Frame:Stainless steel
?? Solder Ball:Sn/Ag/Cu alloy for lead-free type
??OperatingTemperature:-25℃~105℃
Packaging:
?? HardTray