Standard configuration includes SRP-4 probe标配包含SRP-4探头 • Measures:可测试: • Cu foil铜箔厚度 • Surface Cu表面铜 • Cu fine line traces铜导线 • Technique: Micro resistance原理:微电阻 • Tethered probe系绳式探头 • Measure electroless Cu 0.01-0.5 mil (0.25-12.7 µm) • 可测试化学铜厚度范围:0.01-0.5 mil (0.25-12.7 µm) • Measure electrodeposited Cu 0.1-10 mil (0.25-254 µm) • 可测试电镀铜厚度范围: 0.01-6 mil (0.25-152.4 µm) • Measure traces as thin as 8 mil (204 µm) 线性铜线宽最窄可测8 mil (204 µm) • SRP-4 standard probe tip spacing = 9.36 mm SRP-4标准探针间距: = 9.36 mm • SRP-4N narrow probe tip spacing = 5.25 mm SRP-4窄探针间距: = 9.36 mm • Patented user-replaceable tips save time and money compared to competitive gauges with integrated probes具有专利技术的牛津探头 采用用户可替换式探针模块。耗损的探针能在现场迅速、简便地更换, 将停机时间缩至***。更换探针模块远比更换整个探头经济。 C