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- ABLESTIK/爱博斯迪科品牌
- 2032S型号
ABLESTIK ABP 2032S胶水 乐泰导电银胶2032S
LOCTITE ABLESTIK ABP 2032S provides the following product characteristics: Technology Epoxy Appearance Silver Cure Heat cure Product Benefits ● Electrically conductive ● Low temperature cure ● Good adhesion ● Good dispensing characteristics Application Die attach Key Substrates Au, Steel and Ag LOCTITE ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications. TYPICAL PROPERTIES OF UNCURED MATERIAL Viscosity, Brookfield CP51, 25 °C, mPa·s (cP): Speed 5 rpm 11,000 Thixotropic Index (5/6 rpm) 4.5 Work Life @ 25°C, hours 24 Shelf Life @ -40°C (from date of manufacture), days 365 Flash Point - See SDS TYPICAL CURING PERFORMANCE Cure Schedule 60 minutes @ 80°C Alternative Cure Schedule 3 minutes @ 150°C or 10 minutes @ 120°C Weight Loss Weight Loss on Cure, % 0.7 The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers&＃39; experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures. TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties Glass Transition Temperature (Tg) by TMA, °C 110 Coefficient of Thermal Expansion : Below Tg, ppm/°C 54 Above Tg, ppm/°C 162 Thermal Conductivity , W/(m-K) 1 Extractable Ionic Content, , ppm: Chloride (Cl-) <30 Sodium (Na+) <20 Potassium (K+) <20 Dynamic Tensile Modulus, DMA: @ 25 °C N/mm² 4,600 (psi) (667,173) @ 100 °C N/mm² 1,200 (psi) (174,045) @ 250 °C N/mm² 150 (psi) (21,755) Electrical Properties Volume Resistivity, ohm-cm 0.0002 TYPICAL PERFORMANCE OF CURED MATERIAL Die Shear Strength @ 25 °C: 2 X 2 mm Si die, kg-f : Sample cured 60 minutes @ 80°C: On Au 16 On Steel 15.5 On Ag 16
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