IGBT模块是由IGBT(绝缘栅 双极型晶体管 芯片)与FWD(续流二极管芯片)通过特定的电路桥接封装而成的模块化半导体产品;封装后的IGBT模块直接应用于变频器、 UPS不间断电源 等设备上;IGBT模块采用预涂热界面材料(TIM),能让电力电子应用实现一致性的散热性能。此外,IGBT模块可以借助压接引脚进行安装,从而实现无焊料无铅的功率模块安装。还能提供汽车级IGBT模块解决方案,以支持混合动力电动汽车的设计。IGBT一般分为IGBT单管和IGBT模块。简而言之IGBT电流密度高且功耗低,能够提高能效、降低散热需求,从而有效降低整体系统成本。它们应用于通用逆变器、太阳能逆变器、不间断电源(UPS)、感应加热设备、大型家电、焊接以及开关电源(SMPS)等领域。 We currently stock over 12000+ branded products.
---Invensys Foxboro: I/A Series system, FBM(input / output modules) Sequence control, ladder logic control, Recalling accident treatment, The digital-to-analog converter input/output signal processing, Data munication and processing, and etc. ---Invensys Triconex: Redundancy fault tolerant control system, Based on the three module redundancy (TMR) structure of the most modern fault-tolerant controller. ---Westinghouse: OVATIONN system, WDPF system, WESStation system card. ---Modicon: Quantum 140 Series processor, control card, Power module and so on. ---Rockwell Allen-Bradley: Reliance, SLC500/1747/1746, MicroLogix/ 1761/ 1763/ 1762/ 1766/ 1764, pactLogix/1769/1768,Logix5000/1756/1789/1794/1760/1788, PLC-5/1771/1785 and etc. --- Industrial robot parts of DSQC series, Bailey INFI90, etc. ---Siemens: Siemens MOORE, Siemens Simatic C1, Siemens numerical control system, etc. ---Motorola: MVME162, MVME167, MVME1772 and MVME177 series.