助焊劑沒有裂紋 Residue with plasticity ICT專用 Applicable for ICT | | 助焊劑全透明 Transparent flux residue |
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濕潤性好 Reducing the cold solder by heat resistance | | 0.1mm間离,沒有塌陷 No shape change before and after heated |
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一般特性 General characteristics 冷藏庫保管6個月(0-15℃) Keep in refrigerator 6 months(0-15℃) |
項目 Item | 代表特性 Typical Characteristics | 试验方法 Test Method | 合金組成 Alloy Composition | Sn-3.0Ag-0.5Cu | | 固相-液相 Liquids-Solidus | (℃) | 218-220 | | 粒度 Particle Size | 20~38µm | | 松香型號 Flux Type | JIS 中活性 Mildly Activated | JIS Z 3284 | 松香含有量 Flux Content | (%) | 11.5 | JIS Z 3197 | 鹵素含有量 Halide Content | (%) | 0.03 | 配合值 Blend Value | 铜板腐蝕试验 Cupper Plate Corrosion Test | 合格 Pass | JIS Z 3284 | 铬酸盐纸试验 Silver Chromate Test | 合格 Pass | JIS Z 3284 | 铜镜試驗 Cupper Mirror Test | 合格 Pass | JISZ 3197 | 绝缘抵抗试验 | 40℃90%RH | 5.2E+12Ω | | Electric Insulation Resistance Test 168hr | 85℃85%RH | 1.2E+9Ω | JIS Z 3284 | 电压印加试验 | 40℃90%RH | 5.6E+12Ω | | Voltage-applied Moistrue Resistance DC45V,168hr | 85℃85%RH | 1.7E+9Ω | IPC.TM.650 | 擴展率 Rate of Spread | (%) | 80.7 | JIS Z 3197 | 锡球试验 Solder ball test | 良好 Good | 日本半田试验方法 Nihon Handa Method | 100gf以上粘着力保持時間 Tackiness Keeping Time | 24hr | JIS Z 3284 | 预热试验 Preheating Slumping Test | 0.2mm合格 0.2mm Pass | JIS Z 3284 | 流动特性试验 | 粘度(Pa.s) Viscosity | 207 | | Fluidity Characteristics | Ti值 Ti Value | 0.62 | JIS Z 3284 |
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